Ultrasonic Cylindrical Sputtering Target Bonding Machine

This equipment is mainly used for the manufacture of ITO target materials. Using the principle of ultrasound, it can evenly infiltrate indium metal into the surface of copper plates, ITO glass, silicon dioxide and other metals and non-metals. The tool head can be designed according to the coating surface of the product, such as flat, inner circle and outer circle target binding. Compared with the traditional process, this equipment has the advantages of fast aging, saving materials and not easy to fall off.

Application materials:

Copper plate, ITO glass, silicon dioxide, etc.

Technical parameter:

Notice:

1. Do not gather too much indium around the welding head during coating (the thickness of indium is preferably within 2~5C), which is not conducive to spraying. And it will easily transfer heat to the vibrating rod, causing damage to the vibrator. It is best to use a stainless steel plate to scrape the excess indium to one side.

2. Move the welding head on the copper plate or ITO target once, scrape the excess indium on the surface with a shovel to see if there are blind spots. Generally, the copper plate needs to be welded 2~3 times, the ITO target needs to be welded 4~5 times, and the moving speed of the welding head About 1~2 cm/sec.

3. There is no need to add additional pressure to the welding head during coating, and it can move by its own weight and vibration.

4. It is recommended to rest for 1-2 minutes every 4-5 minutes during work to avoid damage to the vibrator and welding head due to overheating. The vibrator can also be connected to clean compressed air to dissipate heat to extend its life.

Application areas:

Plane, cylinder